doc. no : qw0905-LG5040-PF rev. : a date : 02 - sep - 2008 data sheet LG5040-PF rectangle type led lamps ligitek electronics co.,ltd. property of ligitek only pb lead-free parts
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. part no. LG5040-PF page 1/5 package dimensions ligitek electronics co.,ltd. property of ligitek only 2.0 25.0min 2.54typ 1.0min 0.5 typ 4.0 1.5 max 7.6 0 0 100% 50% 75%25% -60 -30 100% 50% 25% 75% 60 30
565 ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 peak wave length pnm typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. tstg storage temperature part no material LG5040-PF emitted gap green green diffused lens color part no. LG5040-PF i f forward current operating temperature reverse current @5v power dissipation peak forward current duty 1/10@10khz t opr ir pd i fp parameter symbol -40 ~ +100 luminous intensity @10ma(mcd) viewing angle 2 1/2 (deg) forward voltage @20ma(v) spectral halfwidth nm 302.6 1.7 min.max. 7.0 4.5128 min. typ. page 2/5 30 ma -40 ~ +85 10 a 100 120 ma mw g ratings unit
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. LG5040-PF 3/5
part no. LG5040-PF page 4/5 ligitek electronics co.,ltd. property of ligitek only 2.wave soldering profile dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 260 c3sec max 5 /sec max 150 time(sec) 100 260 temp( c) 50 preheat 2 /sec max 120 0 0 25 60 seconds max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above.
5/5 page reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 part no. LG5040-PF reliability test: test item operating life test test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature high humidity test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solder resistance test solderability test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2
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